3D Integration in VLSI Circuits Implementation Technologies and Applications

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3D Integration in VLSI Circuits Implementation Technologies and Applications

3D Integration in VLSI Circuits Implementation Technologies and Applications

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3D Integration in VLSI Circuits Implementation Technologies and Applications

  • Brand: Unbranded

$119.00

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$119.00

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Description

3D Integration in VLSI Circuits Implementation Technologies and Applications

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods such as 2.5-dimensional (2.5D) interposer-based integration 3D integrated circuits (3D ICs) 3D systems-in-package (SiP) 3D heterogeneous integration and monolithic 3D I
  • Brand: Unbranded
  • Category: Computing & Internet
  • Format: Paperback
  • Language: English
  • Publication Date: 2025-02-25
  • Publisher / Label: Taylor & Francis Ltd
  • Author: Katsuyuki Sakuma (IBM Thomas J. Watson Research Center USA.)
  • Number of Pages: 234
  • Fruugo ID: 479447672-997879249
  • ISBN: 9781032095547

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