Features: Professional BGA162/BGA186 Flash Memory Chip enable connection for eMCP/eMMC data recovery and chip reading/writing without additional programmers. Spring loaded probes with automatic alignment support BGA162/BGA186 packages, featuring heat resistant engineering plastics and speed transmission for efficient chip operations. Ideal for data recovery specialists, mobile repair technicians, and developers requiring reliable access to unencrypted flash memory chip from water damaged or malfunctioning devices. Perfect for retrieving lost contacts, photos, videos from damaged smartphones or performing batch chip programming in repair workshops and electronics. Can leverages 3rd party software for streamlined data extraction workflows. Specifications: Component:Plastic Size:Approx.4x9cm/1.57x3.54inch Package Includes: 1 Set Burning Seat note: 1.Please allow 1-2cm errors due to manual measurement, making sure that you not mind before order. 2.Due to the differences between different monitors, the picture may not reflect the actual of the item.