1. PROFESSIONAL GRADE FOR BGA REBALLING KIT: This comprehensive kit includes a template holder designed for enhanced performance in for BGA soldering. Crafted from robust stainless steel, it's built to withstand temperatures and extensive use, ensuring consistent results across multiple applications. 2. DIRECT HEAT COMPATIBLE: The stencils can be directly heated with a hot air, streamlining the rework process. This feature allows for simple reuse and reduces waste, making it an efficient tool for electronics professionals. 3. VERSATILE APPLICATION: Suitable for second and thirdgeneration for BGA package memory, this reballing stencil set is for desktop graphics memory and integrated notebook memory. It's compatible with 0.45mm solder balls, catering to various for BGA packages. 4. CONVENIENT HOLDER STATION: The included for BGA rework holder station offers stability and ease of use. It enhances the reballing process, making it smoother and more efficient. Available in two sizes: approximately 671510mm/2.630.590.39'' and 752022mm/2.950.780.86''.