Features: Enhances the performances and extend the life For BPI F3 development board with our efficient heat sink Pad, provide optimaled heat management. Copper component for better thermal conductivity, this 6piece set ensures comprehensive coverage and easy installation and not need for special tools. For electronics enthusiasts, developers, and project creators who require stable operation for their devices. Perfectly for long running development board projects such as home systems and robotic control applications, where need consistent performances. Ensuring For F3 operates smoothly and efficiently, making it a reliable choice for any demanding task. Specifications: Name：Heatsink Pad For BPI F3 Development Board Component： Copper Quantity: 6Pcs/Set Size: Various as Pictures Package Includes: 1Set Heatsink Pad note: Due to the problem of lighting effects, there is certain tolerances in product, please understand. Please allow 0-1cm error due to the measurment.