1、OXIDATION RESISTANT: About 150 degrees(Celsius) when heated becomes liquid and completely covers the small gap between the BGA component and the PCB. In this way, all solder balls are covered with flux and all PCB and component pads and balls are protected from oxidation during reflow or removal of BGA components 2、NON CORROSIVE: Not a clean flux that will not cause corrosion if not cleaned, but can be cleaned very easily if needed without causing corrosion to the PCB or components 3、CLEAN AND LESS SMOKE: Due to the liquid nature, a very small amount of p23 liquid flux is required for each service, resulting in a cleaner working environment. Contains no halogen and produces the least amount of smoke 4、FOR REFLOW: The P23 is very sticky and specifically designed to keep the solder ball inside the template during heavy balling. Also ideal for backflow of BGA components(with heat gun) when unwanted heavy ball equipment is available 5、EASY TO GET STARTED: Due to the fluidity of liquid flux, ideal for microwelding even for inexperienced technicians