Feature:1. Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature.2. Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners.3. Perfect Fitting: Allows for wide application on for A13 CPU as well as for For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max, very useful.4. Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using.5. Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.Specification:Item Type: Phone CPU BGA Reballing StencilProduct Material: Stainless SteelSpacing: 0.12mmApplicable CPU: For A13Applicable Product Models: For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max. .Package List:1 xPhone CPU BGA Reballing Stencil