Features 1、Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likley to deform under high temperature. 2、Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. 3、Perfect Fitting: Allows for wide application on for A520, A310, S5mini series, and the remplate is also universal for A7, A5, A3, S5, J7 series. 4、Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. 5、Simple Carrying: Compact in size and light in weight as well, the phone CPU rework stencil is very convenient to carry, and simple to work on. Specification Item Type: Phone CPU BGA Reballing Stencil Product Material: Stainless Steel Spacing: 0.12mm Applicable Product Model: For A520, A310, S5mini series, universal for A7, A5, A3, S5, J7 series. Package List 1 x Phone CPU BGA Reballing Stencil