This burn-in socket is designed for electronics workshops performing batch aging tests and laboratories evaluating chip performance and long-term stability. Construction focuses on safety and reliable contact, enabling precise chip tests and efficient operation during extended aging cycles. It supports precise testing and aging of QFP64, LQFP64, and TQFP64 chips with a burn-in socket that promotes stability and reliability. Optimizes chip test workflows by providing a dedicated burn-in socket and ensuring compatibility with QFP64, LQFP64, and TQFP64 package chips for consistent results. Use scenarios: - In electronics manufacturing lines performing batch aging on 64-pin QFP devices to screen for early failures. - In R&D labs validating chip performance and stability under burn-in conditions for new product designs. - In test benches to streamline setup, reduce fixture changes, and maintain consistent results across multiple test programs.